Chip carrier


Chip carrier
A standard-sized 8-pin dual in-line package (DIP) containing a 555 timer IC.

A chip carrier, also known as a chip container or chip package, is a container for a transistor or an integrated circuit. The carrier usually provides metal leads, or "pins", which are sturdy enough to electrically and mechanically connect the fragile chip to a circuit board. This connection may be made by soldering or by mechanical force applied by springs or a ZIF socket. Most circuit boards today mount the chips on the surface of the board, although previously it was common to place the pins in through-holes punched into the board. As smaller packages are cheaper, most modern chip carriers are too small for practical installation by humans. Modern microprocessors may have over 1000 pins, so the integrated circuit packaging technology to manufacture and install the carrier must be extremely reliable.

Contents

Types of chip carriers

  • BCC: Bump Chip Carrier [1]
  • BGA: Ball Grid Array (also CBGA, PBGA, FBGA, UFBGA, UBGA, MBGA) [1][2][3]
  • BQFP: Bumpered Quad Flat Pack [1]
  • CBGA: Ceramic Ball Grid Array [1]
  • CCGA: ceramic column grid array (CGA) [1][4]
  • CDIP: Ceramic DIP [3]
  • CERDIP: glass sealed ceramic DIP [3]
  • CERPACK: ceramic package [5]
  • CFP: Ceramic Flat Pack [1]
  • CGA: column grid array [1][4]
  • CLCC: Ceramic Leadless Chip Carrier [3]
  • COB: chip-on-board; a bare silicon chip, that is usually an integrated circuit, is supplied without a package.[4]
  • COF: chip-on-flex; a variation of COB, where a chip is mounted directly to a flex circuit.[4]
  • COG: chip-on-glass; a variation of COB, where a chip is mounted directly to a piece of glass - typically an LCD.[4]
  • CPGA: Ceramic Pin Grid Array [1][6]
  • CQFP: ceramic quad flat-pack, similar to PQFP [1][3]
  • CQGP:[7]
  • CSOP: ceramic SOP [8]
  • CSP: Chip Scale Package (package no more than 1.2x the size of the silicon chip) [9][10]
  • DIL: Dual Inline Package (synonym for DIP) [11]
  • DIP: Dual Inline Package (.1" pin spacing, rows .3" or .6" apart) [11]
  • DFN: Dual Flat Pack, No Lead [1]
  • DLCC: Dual Lead-Less Chip Carrier (Ceramic) [1]
  • ETQFP: Exposed Thin Quad Flat Package [12]
  • FBGA: fine pitch ball grid array, with a square or rectangular array of solder balls on one surface [1]
  • FCPGA: Flip-chip Pin Grid Array [1]
  • HVQFN: Heat-sink very-thin quad flat-pack no-leads
  • LBGA : Low Profile Ball Grid Array (see BGA) (also Laminate Ball Grid Array) [1]
  • LCC: Leadless Chip Carrier, contacts are recessed vertically.[1][4]
  • LCC: Leaded Chip Carrier [1]
  • LCCC: Leaded Ceramic Chip Carrier [1]
  • LLP: Lead Less lead frame Package, a package with metric pin distribution (0.5 mm - 0.8 mm pitch) [13]
  • LFBGA - low profile fine pitch ball grid array [1]
  • LGA: Land Grid Array [1]
  • LQFP: Low-profile Quad Flat Package [1]
  • LTCC: Low temperature co-fired ceramic [14]
  • MCM: Multi-Chip Module [15]
  • MDIP: Molded DIP [16]
  • MELF: Metal Electrode Leadless Face (usually for resistors and diodes) [4]
  • MICRO SMD: a chip-size package (CSP) developed by National Semiconductor [17]
  • MICRO SMDXT: micro Surface Mount Device extended technology [18]
  • MICROARRAY: Usually refers to a chip for testing DNA [19][20]
  • MLF Micro Lead Frame (also called QFN) [21]
  • MLP: Micro Leadframe Package with a 0.5 mm contact pitch, no leads [1]
  • MQFP - Metric Quad Flat Pack, a QFP package with metric pin distribution [1]
  • MSOP: Mini Small-Outline Package
  • OBGA: Organic Ball Grid Array [1]
  • OPGA: Organic Pin Grid Array
  • PAC: Pin Array Cartridge [22]
  • PBGA: Plastic Ball Grid Array [1]
  • PDIP: Plastic DIP [3]
  • PGA: Pin Grid Array (also known as PPGA) [3]
  • PLCC: Plastic Leaded Chip Carrier [1][3]
  • PQFN: power quad flat-pack, no-leads, with exposed die-pad[s] for heatsinking [23]
  • PQFP: Plastic Quad Flat Pack QFP [1][3]
  • PSOP: Plastic small-outline package [1]
  • QFN: Quad Flat No Leads, also called micro lead frame (MLF).[1]
  • QFP: Quad Flat Package [1][3]
  • QIP: Quadruple in-line package, like DIP but with staggered (zig-zag) pins.[3]
  • QSOP: Quarter-Size Small-Outline package, with pin spacing of 0.635 mm.[1][4]
  • SBGA: Super BGA - above 500 Pin count [1]
  • SDIP: Skinny DIP (standard DIP with .1" pin spacing, rows .3" apart) [3]
  • SDIP: Shrink DIP (smaller pin spacing than regular DIP) [3]
  • SIDEBRAZE:[24][25]
  • SOD: Small Outline Diode.[4]
  • SOIC: Small Outline Integrated Circuit (Also SOIC NARROW and SOIC WIDE).
  • SOP: Small Outline Package (also PSOP, TSOP, SSOP, TSSOP) [3]
  • SOT: Small Outline Transistor (also SOT-23, SOT-223, SOT-323).[4]
  • SSOP: Shrink Small-Outline Package [1]
  • SIP: Single in-line package
  • TBGA: Thin Ball Grid Array [1]
  • TCSP: True Chip Size Package (package is same size as silicon) [26]
  • TDSP: True Die Size Package (same as TCSP) [26] h
  • TEPBGA: Thermally Enhanced Plastic BGA.
  • TFBGA - thin fine pitch BGA.[1][4]
  • TO-XX: wide range of small pin count packages often used for discrete parts like transistors or diodes.
    • TO-3
    • TO-5
    • TO-18: metal can package with radial leads
    • TO-39
    • TO-46
    • TO-92: plastic encapsulated package with three leads
    • TO-99
    • TO-100
    • TO-220: plastic package with a (usually) metal heat sink tab and three leads
    • TO-252
    • TO-263
    • TO-263 THIN:
  • TQFN: Thin Quad Flat No-Lead
  • TQFP: Thin Quad Flat Pack [1][3]
  • TSOP: Thin Small-outline Package [1]
  • TSSOP: Thin Shrink Small Outline Package [1]
  • TVSOP: Thin Very Small-Outline Package [1]
  • UCSP: Similar to a BGA (A Maxim trademark example) [10]
  • μBGA - micro-BGA (Ball grid array), with ball spacing less than 1 mm
  • μMAX: Similar to a SOIC. (A Maxim trademark example)
  • UFBGA: Ultra Fine BGA [1][4]
  • VQFB: Very-thin Quad Flat Pack [1]
  • WSON: Very Very Thin Small Outline No Lead Package
  • ZIP: Zig-zag in-line package

See also


External links

References

  1. ^ a b c d e f g h i j k l m n o p q r s t u v w x y z aa ab ac ad ae af ag ah ai aj ak al am an http://www.interfacebus.com/Design_Pack_Type_SOIC.html
  2. ^ Ball grid array
  3. ^ a b c d e f g h i j k l m n o http://www.cpushack.net/Packages.html
  4. ^ a b c d e f g h i j k l SMT
  5. ^ http://www.national.com/packaging/parts/CERPACK.html
  6. ^ CPGA
  7. ^ http://www.national.com/packaging/parts/CQGP.html
  8. ^ http://howto.wikia.com/wiki/Howto_identify_chip_packages/Small_outline_package
  9. ^ http://www.siliconfareast.com/csp.htm
  10. ^ a b http://www.maxim-ic.com/appnotes.cfm/an_pk/4002
  11. ^ a b Dual in-line package
  12. ^ http://ir.conexant.com/releasedetail.cfm?ReleaseID=431800
  13. ^ http://www.national.com/analog/packaging/llp
  14. ^ http://www.minicaps.com/ltcc.html
  15. ^ http://ieeexplore.ieee.org/xpl/freeabs_all.jsp?arnumber=410760
  16. ^ http://www.national.com/ms/PA/PACKING_CONSIDERATIONS__METHODS__MATERIALS_AND_REC.pdf
  17. ^ http://www.national.com/analog/packaging/appnote_msmd
  18. ^ http://www.national.com/news/item/0,1735,1116,00.html
  19. ^ DNA microarray
  20. ^ http://opa.yale.edu/news/article.aspx?id=4538
  21. ^ http://www.eetasia.com/ART_8800353559_480100_NP_9b8d1426.HTM
  22. ^ Meyers, Michael; Jernigan, Scott (2004). Mike Meyers' A+ Guide to PC Hardware. The McGraw-Hill Companies. ISBN 9780072231199. http://books.google.com/books?id=mvo5rpAX3RsC&pg=PT94&lpg=PT94&dq=PAC+%22Pin+Array+Cartridge%22&source=bl&ots=RH4pEfj5sr&sig=Ac_FN1bMuT5dOtDyYakJKa7b7AA&hl=en&ei=tmicS4POKIf-sgOk_qm_Aw&sa=X&oi=book_result&ct=result&resnum=10&ved=0CCcQ6AEwCTgU#v=onepage&q=PAC%20%22Pin%20Array%20Cartridge%22&f=false. 
  23. ^ http://www.motorola.com/mediacenter/news/detail.jsp?globalObjectId=2791_2269_23
  24. ^ http://www.chelseatech.com/packages.htm
  25. ^ http://cpu.linuxmania.net/liste/cpuinfo/chip-package/SIDEBRAZE_DIP/chip-package-sidebraze.htm
  26. ^ a b http://www.chipscalereview.com/issues/ES/issues/0301/packagingFoundries.html

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