noun see solder II

New Collegiate Dictionary. 2001.

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  • Solderability — defines whether a solder can perform as intended in service under normal fabrication methods or processes. The electronic industry has a consensus specification which provides guidelines for classifying, testing, marking, and packaging accepted… …   Wikipedia

  • Solderability — Solderability. См. Паяемость. (Источник: «Металлы и сплавы. Справочник.» Под редакцией Ю.П. Солнцева; НПО Профессионал , НПО Мир и семья ; Санкт Петербург, 2003 г.) …   Словарь металлургических терминов

  • Organic Solderability Preservative — Organic Solderability Preservative, or OSP is a method for plating printed circuit boards. It uses a water based organic compound that selectively bonds to copper and provides an organometallic layer that protects the copper during soldering.… …   Wikipedia

  • Паяемость — Solderability Паяемость. Относительная легкость и скорость, с которой поверхность металла смачивается расплавленным припоем. (Источник: «Металлы и сплавы. Справочник.» Под редакцией Ю.П. Солнцева; НПО Профессионал , НПО Мир и семья ; Санкт… …   Словарь металлургических терминов

  • Soldering — For the song, see Soldering (song). For the product, see Solder. Desoldering a contact from a wire. Soldering is a process in which two or more metal items are joined together by melting and flowing a filler metal (solder) into the joint, the… …   Wikipedia

  • Plating — describes surface covering where a metal is deposited on a conductive surface. Plating has been done for hundreds of years, but it is also critical for modern technology. Plating is used to decorate objects, for corrosion inhibition, to improve… …   Wikipedia

  • Titanium — This article is about the chemical element. For other uses, see Titanium (disambiguation). scandium ← titanium → vanadium …   Wikipedia

  • Dip soldering — apparatus. Dip soldering is a small scale soldering process by which electronic components are soldered to a printed circuit board (PCB) to form an electronic assembly. The solder wets to the exposed metallic areas of the board (those not… …   Wikipedia

  • MIL-STD-883 — The MIL STD 883 standard establishes uniform methods, controls, and procedures for testing microelectronic devices suitable for use within Military and Aerospace electronic systems including basic environmental tests to determine resistance to… …   Wikipedia

  • terneplate — /terrn playt /, n. steel plate coated with terne metal. [1855 60; obs. terne ( < F: dull; see TARNISH) + PLATE1] * * * Steel sheet with a coating of terne metal, an alloy of lead and tin applied by dipping the steel in molten metal. The lead… …   Universalium

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